What are the characteristics of AOI:
(1) The high-speed inspection system has nothing to do with PCB mounting density.
(2) Fast and convenient programming system.
(3) Use a wealth of dedicated multi-function detection algorithms and binary or gray level optical imaging processing technology for detection.
(4) The detection window is automatically corrected according to the instantaneous change of the position of the detected components to achieve high-precision detection.
(5) Check the detection points by marking directly on the PCB with ink or using graphical errors on the operating display.
Patch processing
AOI can be placed after printing, before welding and after welding.
(1) AOI is placed after printing. The printing quality of solder paste can be inspected. It can detect whether the amount of solder paste is appropriate, whether the position of the solder paste pattern is shifted, and whether there is adhesion between the solder paste patterns.
(2) AOI is placed after the patch and before welding. Process inspection can be done on the quality of the patch. It can detect wrong component placement, component displacement, reverse component placement (such as resistance flipping), component side stand, component loss, wrong polarity, and excessive mounting pressure causing adhesion between solder paste patterns, etc.
(3) AOI is placed after reflow soldering. Can do welding quality inspection. It can detect wrong component placement, component displacement, reverse component placement (such as resistance flipping), missing component, wrong polarity, solder joint wettability, excessive solder quantity, too little solder quantity, missing solder, and virtual Welding defects such as soldering, bridging, solder balls (soldering balls between pins), component tilting (tombstone), etc.
