Judgment criteria for solder joints in PCBA processing
Due to the influence of some indispensable unstable factors, there are some problems related to the quality of solder joints. Generally, there is an acceptable range for the welding conditions of PCBA processing. If it exceeds a certain limit, the reliability of the product will be affected, and it will be judged as a defective product. Then I will discuss it with my friends.
PCBA processing
In PCBA processing, according to the IPC-610 standard, the judgment of poor solder joints is: first, the pad is not completely covered by solder, and the exposed corners of non-round pads and round pads must be judged as poor solder joints. . Second, if the feet of the corroded parts or the green paint are deteriorated, the discoloration is caused by poor solder joints. Third, the tin point of the tin tip component protrudes more than 0.5mm. Fourth, cracked or cracked solder. Fifth, solder joint width solder joint width less than 75% of the component solder end width (W) or less than 50% of the land width (P) is bad.
