SMT process technical requirements
With the rapid development and popularization of SMT, its process technology is becoming more mature and beginning to be standardized. The United States, Japan and other countries have formulated corresponding standards for SMT process technology. my country has also formulated: “General Technical Requirements for Surface Mounting Process”, “Technical Requirements for Assembling Printed Board Assembly”, “Requirements for Surface Mounting of Electronic Components” and other Chinese electronics industry standards. Among them, “General Technical Requirements for Surface Mounting Process” The classification of SMT production line and assembly process flow, the basic requirements for components and substrates and process materials, the basic requirements for each production process, the basic requirements for storage and production environment and electrostatic protection are standardized (see appendix).
SMT process design and management can use the above standards as a guide to present some technical requirements. Due to the rapid development of SMT, its process technology will continue to be updated, so in practical applications, attention should be paid to the applicability of the above-mentioned standard references.
SMT process technology development trend
The development and progress of SMT process technology are mainly moving in 4 directions. The first is to adapt to the assembly requirements of new surface mount components; the second is to adapt to the development of new assembly materials; the third is to adapt to the variety of modern electronic products and the ability to update quickly; the fourth is to meet the high-density assembly, three-dimensional Three-dimensional assembly, micro-electromechanical system assembly and other new assembly forms meet the assembly requirements. mainly reflects in:
(1) With the fine pitch of component pins, the micro-assembly equipment and its process technology with 0.3mm lead pitch have become mature, and are developing in the direction of improving the quality of assembly and increasing the pass rate of one assembly;
(2) With the popularization of the arrayed forming pin form at the bottom of the device, the corresponding assembly process and its detection and repair technology have become mature and are still being improved;
(3) In order to meet the development needs of green assembly and the assembly process requirements after the use of lead-free solder and other broken assembly materials, related assembly process technology research is underway;
(4) In order to meet the assembly requirements of multi-variety, small batch production and rapid product update, technologies such as rapid assembly process reorganization technology, sniper assembly process optimization technology, and assembly design and manufacturing integration technology are constantly being proposed and are being researched;
(5) In order to adapt to the assembly process technology of high-density assembly and three-dimensional assembly, it is the main content that needs to be studied in the future;
(6) Surface assembly technology with special assembly requirements such as strict installation orientation and accuracy requirements is also the content that needs to be studied in the future, such as the surface assembly of micro-electromechanical systems.
