The special requirements of the reflow soldering process of the through-hole plug-in component on the equipment A-989

1. Printing equipment

For double-sided mixing, because there is already a welded SMCSMD on the THC component surface, the flat template cannot be used to print the land, and a special three-dimensional tubular peripheral printing machine or a spot welding machine is required to apply the solder paste.

2. Reflow welding equipment

When welding THC. The reflow soldering furnace must have the function of independently controlling the temperature up and down in each temperature zone of the entire furnace, and can increase the temperature at the bottom of the reflow soldering furnace.

In THC reflow soldering, the component surface is on the upper side and the welding surface is on the lower side. Therefore, the furnace temperature distribution is required to be exactly the opposite of the SMCSMD reflow soldering. THC reflow welding requires high temperature under the furnace guide rail (welding surface), and the temperature on the furnace guide rail (component surface) needs to be lowered. Therefore, the reflow soldering furnace must have the ability to independently control the temperature in each temperature zone of the entire furnace. Features.

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Because the component body of the through-hole component is relatively large, the solder quantity of the solder joint is more than that of the SMCSMD. The soldering surface, the component surface and the socket hole of the plug-in component must be filled with solder, so the heat capacity is large and the furnace is required to be higher. You must choose a hot blast stove or hot blast + far-infrared stove with a relatively high furnace temperature and a uniform temperature. The welding equipment of the through-hole component reflow welding process can be solved by the following methods.

①Adopt the existing reflow soldering furnace to adjust the temperature curve.

②The existing reflow soldering furnace uses reflective materials to process special screen tooling to protect the package body of the component

③Using special equipment.

 

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