How to solder SMT chip components and lead components
SMT chip components are particularly small in size and light in weight, and chip components are easier to solder than lead components. SMD components also have a very important advantage, that is, it improves the stability and reliability of the circuit, and for production, it improves the success rate of production. This is because the chip components have no leads, thereby reducing stray electric fields and stray magnetic fields, which is very obvious in high-frequency analog circuits and high-speed digital circuits.
SMT chip component soldering method: put the component on the pad, and then apply the adjusted patch solder paste on the contact between the component pin and the pad (be careful not to apply too much to prevent short circuit), and then use A 20W internally heated electric soldering iron heats the joint between the pad and the SMT component (the temperature should be 220~230℃). After seeing the solder melt, the electric soldering iron can be removed, and the soldering is completed after the solder solidifies. After soldering, you can use tweezers to clamp the soldered patch component to see if there is any looseness. If there is no looseness (it should be very strong), it means that the soldering is good.
SMT
SMT lead component soldering method: when starting to solder all the pins, solder should be added to the tip of the soldering iron, and all the pins should be coated with flux to keep the pins moist. Touch the end of each pin of the chip with the tip of the soldering iron until you see the solder flowing into the pin. When soldering, keep the tip of the soldering iron parallel to the soldered pin to prevent overlap due to excessive soldering.
After smt patch processing and soldering all the pins, wet all the pins with flux to clean the solder. Absorb the excess solder where needed to eliminate any short circuits and overlaps.
