1. Explanation of common English abbreviations for SMT
ACA: Anisotropic Conductive Adhesive
ACAF: Anisotropic Conductive Adhesive Film
Al: Aluminum (Aluminium)
ALIVH: All Inner Via Hole
AOI: Automatic Optical Inspection (Automatic Optical Inspection)
ASIC: Application Specific Integrated Circuit (Application Specific Integrated Circuit)
ATE: Automatic Test Equipment (Automatic Test Equipment)
Au: Gold. (Gold)
BCB: Benzo Cyclo Butene (Benzocycohutence, Benzo Cyclo Butene)
BeO: Beryllium Oxide)
BIST: Built-In Self-Test (Function)
BIT: Bipolar Transistor
BTAB: Bumped Tape Automated Bonding
BGA: Ball Grid Array
BQFP: Quad Flat Package With Bumper
C4: Controlled Collapsed Chip Connection
CAD: Computer Aided Design (Computer Assisted Design)
CBGA: Ceramic Ball Grid Array
CCGA: Ceramic Column Grid Array
CLCC Leaded Chip Carrier (Ceramic Leaded Chip Carrier)
CML: Current Switch Logic (Current Mode Logic)
CMOS: Complementary Metal-Oxide-Semiconductor
COB: Chip On Board
COG: Chip On Glass
CSP: Chip Size Package (Chip Size Package, Chip Scale Package)
CTE: Coefficient of Thermal Expansion (Coefficient of Thermal Expansion)
CVD: Chemical Vapor Deposition
DCA: Direct Chip Attach
DFP: Dual Flat Package (Dual Flat Package)
DIP: Double In-line Package (Double In-line Package, Dual In-line Package)
DMS: Direct Metallization System
DRAM: Dynamic Random Memory System (Dynamic Random Memory System)
DSO: Dual Small Outline
DTCP: Dual Tape carrier Package (Dual Tape carrier Package)
3D: three-dimensional (package), three-dimensional (package) (Tree-Dimension (Package))
2D: Two-Dimension (Package) (Two-Dimension (Package))
EB: Electronic Beam
ECL: Emitter-Coupled Logic (Emitter-Coupled Logic)
FC: Flip Chip Method, Flip Chip
FCB: Flip Chip Bonding
FCOB: Flip Chip On Board
FEM: Finite Element Method (Finite Element Method)
FP: Flat Package
FPBGA: Fine Pitch Ball Grid Array (Fine Pitch Ball Grid Array)
FPD: Fine Pitch Device (Fine Pitch Device)
FPPQFP: Fine Pitch Plastic Quad Flat Package (Fine Pitch Plastic Quad Flat Package)
GaAs: Gallium Arsenic
GQFP: QFP with guard ring (Guard-Ring Quad Flat Package)
HDI: High Density Interconnection
HDMI: High Density Multiplayer Interconnection
HIC: Hybrid Integrated Circuit (Hybrid Integrated Circuit)
HTCC: High Temperature Co-Fired (Alumina) Ceramic
HTS: High Temperature Storage (Test) (High Temperature Storage)
IC: Integrated Circuit (Int^rated Circuit)
IGBT: Insulated Gate Bipolar Transistor (Insulated Gate Bipolar Transistor)
ILB: Inner-Lead Bond (ing))
[/O: Input/Output
IVH: Inner Via Hole
JLCC: J-Leaded Chip Carrier (J-Leaded Chip Carrier)
KGD: Known Good Die
LCC: Leadless Chip Carrier
LCCC: Leadless Ceramic Chip Carrier
LCCP: Lead Chip Carrier Package (Lead Chip Carrier Package)
LCD: Liquid Crystal Display (Liquid Crystal Display)
LCVD: Laser Chemical Vapor Deposition (Laser Chemical Vapor Deposition)
LDI: Laser Direct Imaging
LGA: Land Grid Array
LSI: Large Scale Integrated Circuit (Large Scale Integrated Circuit)
LOC: Lead Over Chip
LQFP: Low Profile Quad Flat Package (Low Profile Quad Flat Package)
LTCC: Low Temperature Co-Fired Ceramic
MBGA: Metal Ball Grid Array
MCA: Multiple Channel Access
MCM: Multi-Chip Module
MCM-C: Muhi Chip Module with Ceramic Substrate
MCM-D: Multi Chip Module with Deposited Thin Film Interconnect Substrate
MCM-C/D: Thick/W Film Hybrid Integrated Multi Chip Module (Multi Chip Module with Thin Film Deposited on Ceramic Substrate)
MCM-L: Multi-Chip Module with Laminated Substrate
MCP: Multi Chip Package
MEFB: Metal Electrode Face Bonding
MELF: Metal Electrodes Leadless Face Components
MEMS: Micro electro Mechanical System (Micro electro Mechanical System)
MFP: Mini Flat Package (Mini Flat Package)
MLCP: Multi-Layer Ceramic Package (Multi-Layer Ceramic Package)
MMIC: Monolithic Microwave Integrated Circuit (Monolithic Microwave Integrated Circuit)
MOSFET: Metal Oxide Semiconductor Field Effect Transistor (Metal-Oxide-Silicon Field-Effected Tran sistor)
MPU: Microprocessor (Micro Processor Unit)
MSI: Medium Scale Integration
OLB: Outer Lead Bonding
PBGA: Plastic Ball Grid Array
PC: Personal Computer, Personal Computer (Personal Computer)
PCB: Printed Circuit Board (Printed Circuit Board)
PFP: Plastic Flat Package (Plastic Flat Package)
PGA: Pin Grid Array
PI: Polyamide
PIH: Plug-In Hole
PLCC: Plastic Leaded Chip carrier
PTF: Polymer Thick Film
PQFP: Plastic Quad Flat Package (Plastic Quad Flat Package)
QFJ: Quad Flat J-leaded Package
QFP: Quad Flat Package (Quad Flat Package)
QIP: Quad In-line Package
RAM: Random Access Memory (Random Access Memory)
SBB: Stud-Bump Bonding
SBC: Solder-Ball Connection
SCIM: Single Chip Integrated Module (Single Chip Integrated Module)
SCM: Single Chip Module (Single Chip Module)
SLIM: Single Level Integrated Module (Single Level Integrated Module)
SDIP: Shrinkage Dual Inline Package
SEM: Scanning Electron Microscope (Sweep Electron Microscope)
SIP: Single In-line Package
SIP: System In a Package (System In a Package)
SMC: Surface Mount Component
SMD: Surface Mount Device (Surface Mount Device)
SMP: Surface Mount Package (Surface Mount Package)
SMT: Surface Mount Technology (Surface Mount Technology)
SOC: System On Chip (System On Chip)
SOIC: Small Outline Integrated Circuit (Small Outline Integrated Circuit)
SOJ: Small Outline J-leaded Package
SOP: Small Outline Package
SOP: System On a Package (System On a Package)
SOT: Small Outline Transistor
SSI: Small Scale Integration
SSIP: Small Outline Single In-line Plug Package
SSOP: Shrink Small Outline Package
SPLCC: Shrinkage Plastic Leadless Chip Carrier (Shrinkage Plastic Leadless Chip Carrier)
STRAM: Self Timed Random Access Memory (Self Timed Random Access Memory)
TAB: Tape Automated Bonding
TBGA: Tape Ball Grid Array
TCM: Thermal Conduction Module (Thermal Conduction Module)
TCP hysteretic tape carrier package, tape carrier package (Tape Carrier Package)
THT: Through-Hole Technology
TO: Transistor Outline
TPQFP: Thin Plastic Quad Flat Package (Thin Plastic Quad Flat Package)
TSOP: Thin Small Outline Package
TTL: Transistor-Transistor Lc^ic
UBM: Metallization Under Bump
UFPD: Ultra Small Pitch Device (Ultra Small Pitch Device)
USOP: Ultra Small Outline Package
USONF: Uhra Small Outline Package Non Fin without heat sink UV: Ultra Violet (line, light)
VHSIC: Very High Speed Integrated Circuit (Very High Speed Integrated Circuit)
VLSIC: Very Large Scale Integrated Circuit (Very Large Scale Integrated Circuit)
WB: Wire Bonding
WLP: Wafer Level Package
WSI: Wafer Scale Integration
TAB: Tape Automated Bonding
TBGA: Tape Ball Grid Array
TCM: Thermal Conduction Module (Thermal Conduction Module)
TCP hysteretic tape carrier package, tape carrier package (Tape Carrier Package)
THT: Through-Hole Technology
TO: Transistor Outline
TPQFP: Thin Plastic Quad Flat Package (Thin Plastic Quad Flat Package)
TSOP: Thin Small Outline Package
TTL: Transistor-Transistor Lc^ic
UBM: Metallization Under Bump
UFPD: Ultra Small Pitch Device (Ultra Small Pitch Device)
USOP: Ultra Small Outline Package
USONF: Uhra Small Outline Package Non Fin without heat sink UV: Ultra Violet (line, light)
VHSIC: Very High Speed Integrated Circuit (Very High Speed Integrated Circuit)
VLSIC: Very Large Scale Integrated Circuit (Very Large Scale Integrated Circuit)
WB: Wire Bonding
WLP: Wafer Level Package
WSI: Wafer Scale Integration
