In fact, the displacement of components in smt processing is a bad phenomenon in SMT factory. With the development of science and technology and the improvement of people’s living standard, the pursuit of electronic products is becoming more and more miniaturized and precise. However, the traditional DIP plug-in in SMT small batch chip processing factory is not as effective as SMT chip processing, especially for large-scale and highly integrated IC. For many R&D companies, it is a very good choice to send the products to SMT small batch SMD processing factory to adopt the PCBA processing method of SMT package. However, there will be some problems in SMT chip processing, such as component displacement. What’s the matter with the displacement of smt components?
1. During smt chip processing, the air pressure of the suction nozzle is not adjusted properly, and the pressure is not enough, which leads to the displacement of components.
Second, the flux content in the solder paste is too high, and the excessive flux flow in the reflow soldering process leads to the displacement of components.
Third, the solder paste itself is not sticky enough, and some problems such as oscillation and shaking of components occur during handling, resulting in the displacement of components.
Fourth, the use time of solder paste is limited, and the soldering flux in SMT solder paste will deteriorate after it exceeds the service life, resulting in poor soldering of PCBA patch.
5. During the handling of components after SMT printing and PCBA pasting, the components are displaced due to vibration or incorrect handling methods.
Sixth, the mechanical problems of the mounter itself caused the wrong placement of components. Do every step of SMT contracting with care, strictly follow the PCBA processing process, and a good service attitude can bring high-quality PCBA OEM products.
