Huawei’s self-designed HiSilicon K3V2 quad-core processor, clocked at 1.2GHz/1.5GHz The specification of K3V2 quad-core processor is 12*12mm, which is the smallest quad-core processor in the industry at present. At the same time, K3V2 quad-core processor has the strongest embedded GPU in the industry, and uses the highest-end 64-bit bandwidth DDR memory design in mobile phone chips to fully release the performance of quad-core.
It is reported that this high-performance CPU is independently designed by HiSilicon (Huawei subsidiary) and adopts 35nm ARM architecture. Hai K3V2 is the result of two years’ work by Huawei’s chip department. The main frequencies of this processor are 1.2GHz and 1.5GHz respectively. It is claimed that this chip can surpass Tegra 3 performance by 30% to 50% in a series of benchmark tests.
According to the chief architect of Huawei’s chip department, HiSilicon K3V2 chip uses 64-bit memory bus, which is twice that of Tegra 3, which is one of the main reasons for the performance improvement of K3V2 chip. This chip is produced by TSMC in 40nm process, and the chip area is 12x12mm. Huawei also said that the company will sell this processor chip to other companies.
Hai K3V2 uses quad-core ARM Cortex A9 and built-in 16-core graphics chip. The graphics card is jointly developed by Huawei and an unnamed American chip design company. The two companies jointly developed the architecture of the graphics card, and the American partner was responsible for the specific application.
The graphics card chip can handle 2-D and 3-D, and has a video processing capability of 35F/s. According to Huawei’s test, the video processing capability of Tegra 3 is 13fps, while that of dual-core Qualcomm processor is 8.4fps.
