Include the development of PCBs that drive electronic devices and generally control mechanical and pneumatic operations. It brings special challenges to space PCB manufacturing, and these challenges must be overcome to ensure that aerospace systems can complete their tasks safely and reliably. For the manufacture of plates, these are mainly related to the maintenance of structural integrity for changing environmental conditions. PCB assembly is not obvious. However, after defining the development obstacles, we will be able to define a scheme to optimize the assembly of aviation PCB to meet the space challenge.
Space is a challenging environment. It looks peaceful, but it’s also dangerous. The temperature ranges from more than 1000 degrees Fahrenheit to -455 degrees Fahrenheit, which puts great mechanical stress on the spacecraft. In addition, there is the possibility of collision of space debris of various sizes. These hazards and other hazards can be classified as external challenges of orbital platforms and spacecraft. As listed below, there are still some challenges that threaten the internal systems that aviation system development must face.
Ion radiation
Radiation is the focus of all vehicles and systems in space. This is more due to its destructive potential for wireless communication than its excessively concentrated destructive power, which may be a biological problem.
radio-frequency radiation
Radio frequency radiation may also be an important problem. In the atmosphere of the ionosphere, this kind of harm is greatest.
And vibration and mechanical shock.
Reusable rockets for space travel are being developed, which will greatly reduce the vibration effects of launch and landing. Even with these advances, the energy required for launch may still be the source of huge mechanical stress on spacecraft and the vibration source of internal equipment and systems in the future.
environmental control
Because space of spacecraft is usually limited, and temperature and pressure control are required, there are fewer options for heat dissipation compared with ground systems.
extreme temperature
Although extreme temperatures are usually associated with external obstacles to the deployment of aerospace systems, internal equipment may also be worried about this. For example, the temperature near the engine, which is usually monitored and controlled by electronic devices, can be several thousand degrees Fahrenheit.
In order to successfully deploy spacecraft, the above hazards must be overcome. For circuit board manufacturing, the following methods can be used to solve the problem: selecting the right materials can ensure the safe operation in thermal, electrical and mechanical environment. PCBA can also be treated as discussed below.
Optimizing the assembly of aerospace PCB to meet the space challenge
It is always important that your design be combined with a good DFM guide. The benefits of PCB development can’t be exaggerated. However, the quality and reliability of aerospace applications are far higher than those of most commercial applications. This is because the regulatory requirements generally apply to all aerospace developments, as well as challenges specific to your space system and its deployment. These orders require you to select a qualified contract manufacturer (CM), apply for DFM for aerospace PCB development, hire assembly design (DFA) to meet or exceed IPC Level 3 electronic assembly standard, and ensure that solder joints and component positions remain intact in space.
One of the biggest challenges that the circuit boards on the space shuttle will face is radiation. Whether it is ionic or RF type, radiation will damage the circuit board by introducing electromagnetic interference (EMI), thus interfering with the signal quality, changing the impedance and causing crosstalk on the wiring. Therefore, your design should be optimized for power integrity, incorporate special considerations of signal integrity, and ensure that only high-performance components are used. To facilitate this process, you should adopt risk analysis that meets the following conditions: AS9100 includes monitoring and traceability of the supply chain, and add appropriate additional components, such as shielding, in the assembly process.
The best way to deal with the vibration or mechanical stress that may affect the circuit board is to choose materials; However, if your circuit board is flexible or rigid-flexible, these impacts may be severe and may cause your circuit board to exceed its bending limit or components to fall off. Make sure that your PCB layout only has a flat component placement position or requires adding supports to help the assembly, so as to ensure that good solder joints are formed and components are firmly fixed. For heavy components or cases where planarity cannot be achieved, it may be necessary for your CM to use stiffening ribs or increase the adhesion to your flexible board during assembly.
The temperature of all substances will make them lose their shape or shape. This applies not only to board materials, but also to components and solder joints. Under normal circumstances, this should not be a problem. Same, it’s best to choose the components made of it. NASA parts selection list (NPSL). If commercial off-the-shelf (COTS) components are utilized, you may need to perform AS9102B for testing to ensure that the components meet the aerospace industry standards.
Circuit board design for aerospace applications is different from most other commercial applications. First of all, industry standards must be met. Then, specific requirements are generated according to the type of space platform and whether it is in orbit or flying in space.
