Good ingredients for PCB board making are worthy of trust. The speed of hot air motor in reflow oven will directly change the speed of hot air reflow soldering in unit area. Under the influence of hot air speed of reflow soldering on welding quality, the appropriate transportation speed can be adjusted. On the premise of meeting the standard reflow soldering curve, we try our best to meet the customer’s production requirements.
No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation and mechanical properties are good. Compared with other materials, P material has incomparable advantages. Suitable for SMT process of power component surface mounting. The business mainly includes electronic processing of printed circuit board welding, electronic processing of printed circuit board welding, and electronic processing of functional version assembly which can undertake single-sided and double-sided pasting and mixing. At present, the company’s production lines have all been lead-free production (P-fr), and at the same time, it has been processing for many large electronic factories. The products are widely used in civil industries and other fields with different requirements for electronic products. The frequency of fans needs to be adjusted regularly and appropriately. Large quantity and faster heat transfer. In this case, if the frequency of reflow soldering fan is too low, it will easily lead to insufficient heat compensation, resulting in cold welding.
Therefore, the oxygen concentration in nitrogen reflow soldering is protected by nitrogen, which will increase the wetting power of solder. However, more and more examples show that the phenomenon of erecting monuments increases when the oxygen content is too low. It is generally considered that it is appropriate to control the oxygen content in the range of 00~500×10 to the negative 6th power. Solution Adjust the appropriate temperature curve according to each different product. Incorrect furnace temperature curve. If the reflow soldering furnace body is too short and the temperature zone is too small, the working curve of P heating will be incorrect, resulting in excessive humidity difference on the board surface, resulting in unbalanced wetting force. Solution Adjust the process parameters of the mounter.
For other reasons, aluminum-based printed boards have shielding effect; Substitute brittle ceramic substrate; Feel free to use the surface mounting to solve the problem of thermal expansion and cold contraction. Relieve and improve the durability and reliability of the whole machine and electronic equipment. Especially to solve the problem that SMT (surface mount technology) printed board can effectively solve the heat dissipation problem, so that the components on the printed board expand with heat and contract with cold.
The aluminum substrate, which is recognized by consumers, has good dimensional stability and heat dissipation. Products made of high-quality surface mount technology play an outstanding role in the normal operation of products and circuits. Under the action of high temperature, it will perform very well, so we should choose after comparison. After all, only with more powerful functions can it be accepted by more customers. Why is aluminum substrate so recognized by consumers?
