Pcb proofing and cutting dimensions

Pcb proofing and cutting dimensions
① Maximum panel size: 530 * 622mm (tinplate: 450 * 622mm/MAX. Depending on the equipment capacity)
② Pay attention to the latitude and longitude of boards with more than six floors (they must be the same), which will easily cause poor compression.
③ The size of the reserved surface of the multilayer board (8-10 floors, 4 floors, 10-15 floors, more than 6 floors, mm)
④ Common plates with copper core (0.2-3.2mm in 0.1mm radian) and those without copper core (0.05-1.75mm in * * radian).
Inner/outer layer
Pcb proofing
①0.03mm(Hoz) compensation, copper thickness increased by 1oz, compensation increased by 0.025mm
② The width of welding ring requires Hoz 0.15mm pth 0.18 (limit 0.13 0.16).
1 oz (0.17mm depth 0.20) (limit 0.15 0.18)
2 oz (0.19mm depth 0.22) (limit 0.17 0.20)
The thickness of copper is increased by 1 ounce, and the compensation is increased by 0.02 mm.
③ Cutting copper wire: ensure the minimum wire distance: 0.4mm 0.15mm from copper wire (0.3mm from PAD and wire).
Copper hole: 0.250mm wire: 0.15mm pad: 0.2mm four-layer board
Copper hole: 0.250mm wire: 0.18mm pad: 0.2mm above the six-layer board
It is necessary to remove the copper wire produced in the copper extraction process, and it is also necessary to fill the small holes in the copper skin.
For acyclic pth and NPth holes, 0.2mm copper should be cut on one side. If the spacing cannot be ensured, drill holes twice.

HDI board proofing is the early stage of mass production. Only when the calibration is accurate can batch production be put into batch production. Then, it is very important to provide accurate proofreading documents. Does everyone know what documents need to be provided? And what problems should be paid attention to in the provided documents? Today, the editor will share with you:
First, you need to provide a PCB or GERBER file of HDI board proofing. This document should include the description of plate making, including the specific requirements for the number of layers, materials, rubber pad technology, ink color, etc. Let’s know some main parameter descriptions in detail.
Material: In order to explain the materials needed for PCB production, FR4 is the most commonly used material at present, and the main material is fiber cloth board with peeling epoxy resin.
Number of layers: It is necessary to specify the number of layers of PCB. (The price will be different with different layers of PCB, and the proofing process of PCB is the same)
Color of solder mask: There are many colors, which can also be selected according to requirements. Generally, it is green.
Screen color: the color of screen printing fonts and borders printed on HDI proofing PCB is usually white.
Thickness of copper: Usually, the thickness of copper is calculated scientifically according to the current of PCB circuit. Usually, the thicker the better, but the higher the cost, so a reasonable balance is needed.
Whether the through hole is covered by solder resist: the solder resist layer should insulate the through hole, otherwise the through hole will not be insulated.
Surface coating: tin spraying and gold plating.
Quantity: The quantity of PCB produced should be clearly stated.

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