The innovation of high-precision high-frequency circuit board rapid proofing printed circuit lies first in the innovation of PCB products and market. The earliest PCB product is a single panel, with only one layer of conductor on the insulation board, and the line width is measured in millimeters, which is commercially used in semiconductor (transistor) radios. With the advent of TV sets and computers, PCB products have been innovated, with double-panel and multi-layer boards, with two or more layers of conductors on the insulation board, and the circuit width has gradually decreased. In order to adapt to the development of miniaturization and light weight of electronic equipment, flexible PCB and rigid-flexible PCB appeared again.
The process of plugging holes in PCB with resin includes drilling, electroplating, plugging holes, baking and grinding. After drilling, the holes are plated through, and then the resin is plugged and baked. Finally, the resin after grinding is ground flat. Because the ground resin does not contain copper, it needs another layer of copper to turn it into a PAD. These processes are all done before the original PCB drilling process, that is, the hole of the fortress hole is processed first, then other holes are drilled, and the original normal process is followed.
If the hole is not plugged properly, when there are bubbles in the hole, the board may burst when passing through the tin furnace because the bubbles are easy to absorb moisture. However, if there are bubbles in the hole during the plugging process, the bubbles will squeeze out the resin during baking, resulting in a concave and protruding situation. At this time, defective products can be detected, and the board with bubbles may not burst, because the main cause of the board burst is moisture, so if the board that just left the factory or the board was baked when it was loaded, it generally won’t burst. High frequency circuit board
The green plug hole is simple for the whole process flow, and can be operated together with the surface ink in the solder resist dust-free room. Or plug the holes before printing. But the quality of plug hole is not as good as that of resin plug hole. The green plug hole will shrink after curing. For customers who require fullness, this method can’t meet the product quality. High frequency circuit board rapid proofing
CB is a row of gold-plated contacts, and its scientific name is “Golden Finger”. Don’t underestimate these glittering contacts. If one of them falls off or oxidizes, it may cause some hidden troubles. PCB manufacturers need to conduct rigorous tests on each component for many times. Therefore, multiple plugging and unplugging of the memory is inevitable, so they strengthened the “golden finger” part. The PCB part of “Golden Finger” is made of thick 30mil gold-plated layer, which is called “Thousand Gold”. Dingji Electronics has fifteen years’ experience in making boards, focusing on making multi-layer PCB boards for many years, with quality assurance, considerate service and trustworthiness. Dingji Electronics is a very good circuit board processing manufacturer, Dingji high-frequency circuit board.
The manufacturing process of the foil laminate is to impregnate the reinforcing materials such as glass fiber cloth, glass fiber felt and paper with adhesives such as epoxy resin and phenolic resin, and dry them at appropriate temperature to stage B to obtain pre-impregnated materials (referred to as dipping materials for short). Then, they are laminated with copper foil according to the technological requirements, and heated and pressurized on a laminator to obtain the required copper clad laminate. High frequency circuit board
I. Classification of copper-clad laminate. Copper-clad laminate consists of copper foil, reinforcing material and adhesive. Generally, plates are classified according to the categories of reinforcing materials and adhesives or the characteristics of plates.
1. According to the classification of reinforcing materials, the most commonly used reinforcing materials for copper-clad laminates are alkali-free (the content of alkali metal oxide does not exceed 0.5%) glass fiber products (such as glass cloth and glass felt) or paper (such as wood pulp paper, bleached wood pulp paper and cotton linter paper), etc. Therefore, copper-clad laminates can be divided into two categories: glass cloth base and paper base.
2. According to the types of adhesives, the adhesives used for foil-covering boards are mainly phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, foil-covering boards are also divided into phenolic, epoxy, polyester, polyimide and polytetrafluoroethylene foil-covering boards.
3. According to the characteristics and uses of base materials, it can be divided into general type and self-extinguishing type according to the burning degree of base materials in the flame and after leaving the fire source; According to the bending degree of the substrate, it can be divided into rigid and flexible foil-covered plates; According to the working temperature and working environment conditions of the substrate, it can be divided into heat-resistant type, radiation-resistant type, high-frequency foil-coated plate, etc. In addition, there are also foil-clad plates used in special occasions, such as prefabricated inner-layer foil-clad plates, metal-based foil-clad plates, and foil-clad plates which can be divided into copper foil, nickel foil, silver foil, aluminum foil, constantan foil and beryllium copper foil according to the types of foil materials.
In order to make the electronic communication technology develop at a higher speed. High-quality and high-speed transmission. Nowadays, many communication equipment begin to use high-frequency printed multilayer PCB. The material of multilayer high-frequency PCB has excellent electrical function and good chemical stability, mainly including the following four points:
1. It has the characteristics of small signal transmission loss, short transmission delay time and small signal transmission distortion.
2. Excellent dielectric properties (mainly: low relative dielectric constant Dk and low dielectric loss factor Df). Moreover, this dielectric property (Dk, Df) can still keep its stability under the environmental changes of frequency, humidity and temperature.
3. High precision control with characteristic impedance (Zo).
4. Excellent heat resistance (Tg), processability and adaptability.
Based on the above characteristics, HF boards are widely used in wireless antennas, base station receiving antennas, power amplifiers, components (shunts, combiners, filters), radar systems, navigation systems and other communication equipment.
Multi-layer circuit board design, based on cost saving, improving bending strength, electromagnetic interference control and other factors, often appears in the form of mixed board, which is called high-frequency mixed board. There are many kinds of designs for the selection of high-frequency mixed-compression materials and the overlapping combination. Mingyi Electronics produced a multilayer high-frequency circuit board through R&D and experiment, and used high-frequency materials RO4350B/RO4450B and FR4 to mix and press. High frequency circuit board rapid proofing
Our products are widely used in communication, industrial control, computer application, aerospace, military industry, medical treatment, test instruments and other fields. The core competitiveness is: leading process and technology, high quality, high delivery rate, expedited delivery, consulting customer service, and the best cost performance. Has ISO9001, ISO14001, TS16949, GJB9001A, UL(E360485), RoHS certification.
