BGA for SMT processing is a kind of packaging method. BGA is the abbreviation of English BallGridArray, which is translated into Chinese as ball grid array package. In the 1990s, with the continuous development of electronic technology, the processing speed of IC has been continuously improved, and the number of I/O pins on integrated circuit chips has been continuously increased. All levels of factors clearly put forward higher requirements for IC packaging. In addition, in order to consider the development of electronic equipment towards miniaturization and precision, BGA packaging has been put into production with the advent of the world. Below, Pate High Precision, a technical professional SMT chip processing factory, briefly introduces the basic processing information of BGA to everyone.
First, steel mesh
The thickness of steel mesh in the specific SMT process is generally 0, but in the welding process of BGA devices, the thick steel mesh is likely to lead to tin connection. According to Pater’s high-precision surface assembly production experience, the steel mesh with a thickness of 0 is very suitable for BGA devices, and the total opening area of steel mesh can be moderately expanded.
Second, solder paste
The foot spacing of BGA devices is small, so the solder paste used also stipulates that the particles of metal materials should be small, and excessive particles of metal materials will lead to soldering in SMT processing.
Third, the welding temperature setting
In the whole process of SMT chip processing, reflow soldering furnace is generally used. Before soldering BGA package components, the temperature of each area must be set according to the processing regulations and the temperature around the spot welding should be detected by thermal resistance camera.
IV. Inspection after welding
After SMT processing, BGA packaged devices should be rigorously tested, so as to prevent some chip-mounted defects.
V. Advantages of BGA package:
1, the assembly yield is improved;
2, the electric heating performance is improved;
3. The volume and mass are reduced;
4. Parasitic parameters are reduced;
5, the signal transmission delay is small;
6. The frequency of use is increased;
7. High credibility of goods;
VI. Defects of BGA package:
1, after welding inspection must be based on x-ray;
2. The cost of electronic production increases;
3. The repair cost increases;
Because of the packaging characteristics of BGA, the difficulty coefficient in SMT chip soldering is very high, and casting defects and repair are also difficult to operate in practice, so as to ensure the soldering quality of BGA devices, SMT chip processing plants generally pay attention to the customization of processing regulations from the following aspects.
