Electronic component surface cleaning and dust removal treatment
When plasma technology is applied to circuit board cleaning, because the particles in plasma have a very high speed, it can effectively remove the impurity particles attached to the surface, and its purification effect is better than that of conventional treatment systems. At the same time, plasma can activate the surface evenly and improve the surface energy, thus reliably improving the adhesion ability of the surface.
This process can carry out continuous “on-line” treatment on the whole surface or in a local area at a very high speed. If the manipulator is used to control the spray gun, the local treatment effect can be achieved accurately, and the extremely fine contour can be purified, activated and coated.
Process characteristics: the particles in plasma have extremely high velocity, which can effectively remove the impurity particles attached to the surface;
Can carry out continuous “on-line” treatment on the whole surface or in a local area at a very high speed;
Be able to purify, activate and coat extremely fine contours;
Plasma treatment technology was used to clean LCD glass, and the rejection rate was successfully reduced to below 1%.
No solvent is needed, so it is more environment-friendly;
The effect of purify and activating that surface, the deep clean ability and the activating ability can make the subsequently applied heat
The molten glue can adhere well to the substrate; 】
Glue-removing slag of flexible board, glue-removing slag of soft-hard joint board and glue-removing slag of FR-4 micropore with high thickness-diameter ratio:
Improve the binding force between the hole wall and the copper plating layer, thoroughly remove the glue residue, improve the on-off reliability, and prevent the inner layer from opening after copper plating;
Modification and activation of pore wall surface of PTFE microwave plate before copper deposition;
Improve the binding force between the hole wall and the copper plating layer, and prevent the black hole, hole explosion and other phenomena. Soldering resistance and activation of front face of characters:
Effectively preventing solder resist characters from falling off;
Through-hole and blind/buried hole of laser in HDI plate remove carbide burned by laser. Without the requirement of pore size, the effect of micropores with pore size less than 50 microns is more obvious;
Remove the dry film residue (remove the sandwiched film) when fine lines are made;
The PI surface coarsens before the combination of soft and hard plates and before the reinforcement of flexible plates: the tensile force can be increased by more than 10 times;
PCB package front surface cleaning, pre-treatment with gold wire, to improve connection strength and reliability;
