PCBA solderless press-in connection technology, also known as press-in technology, consists of malleable deformable or rigid terminals embedded in two or more sides.
A kind of “moderate press-in” connection produced by the matching of metallized holes of pcb boards, which produces close point contact between the terminal and the metallized holes, and realizes electrical connection by mechanical connection.
The crimping technology has high credibility, safety factor of plugging and easy operability, which prevents the problem of large volume and high heat absorption of RF connector in reflow soldering furnace, and does not easily cause damage or rupture of the power plug of the connector. In addition, welding materials and welding flux are not needed, which solves the problems of difficult cleaning of welded parts and easy air oxidation of welding surfaces. Therefore, the crimping technology continues up to now and is still widely accepted and applied.
The first condition of PCBA crimping technology:
① Press-in terminal; ②pcb board; ③ Crimping processing technology; ④ Special tools and machinery for crimping.
1. Press-in terminal
Press-in terminals (press-in pins) are divided into rigid pins and flexible pins (see figure). Stiffness of pins will not cause deformation in the whole process of crimping, but holes will:
The flexible pin will be deformed by extrusion during the whole crimping process, but the hole will not be deformed.
(1) raw materials
Suitable grade alloy copper shall be selected for pressure connection. Such as copper-tin-aluminum alloy, brass-copper-zinc alloy, red copper or beryllium bronze.
The selection of raw materials lies not only in the specifications and functions of parts, but also in conformity with the regulations of good and stable protective grounding.
All raw materials are related to time, temperature and in-situ stress, resulting in stress relaxation.
The raw material of the terminal and the force configured to maintain the connection are reduced when it is not easy to cause the resistor at the junction to rise to an unacceptable level.
All the production and processing steps of pcbA are complicated and must be controlled by key points. All the quality problems of SMT patches and even PCB bubble glass PCB circuit boards will lead to poor products.
